Invention Grant
- Patent Title: Method of manufacturing flexible circuit substracts
- Patent Title (中): 制造柔性电路基底的方法
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Application No.: US13973273Application Date: 2013-08-22
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Publication No.: US09358789B2Publication Date: 2016-06-07
- Inventor: Mirza Sabanovic , David P. Platt , Chad David Freitag , Joseph Andrew Broderick
- Applicant: Xerox Corporation
- Applicant Address: US CT Norwalk
- Assignee: XEROX CORPORATION
- Current Assignee: XEROX CORPORATION
- Current Assignee Address: US CT Norwalk
- Agency: Marger Johnson
- Main IPC: B41J2/16
- IPC: B41J2/16 ; H05K3/10 ; H05K3/00 ; B41J2/415 ; B41J2/145 ; B41J2/175 ; H05K1/02 ; H05K1/18
Abstract:
A method of manufacturing a flexible circuit, including forming a first set of traces, forming a second set of traces, and cutting a gap between the first and second set of traces.
Public/Granted literature
- US20130333208A1 REDUCTION OF ARC-TRACKING IN CHIP ON FLEXIBLE CIRCUIT SUBSTRATES Public/Granted day:2013-12-19
Information query
IPC分类:
