Invention Grant
- Patent Title: Electrical conduction path structure and wiring harness incorporating the same
- Patent Title (中): 导电路径结构和包括其的线束
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Application No.: US13980275Application Date: 2012-01-18
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Publication No.: US09358936B2Publication Date: 2016-06-07
- Inventor: Hideomi Adachi , Hidehiko Kuboshima , Akio Kitami
- Applicant: Hideomi Adachi , Hidehiko Kuboshima , Akio Kitami
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2011-009445 20110120
- International Application: PCT/JP2012/000270 WO 20120118
- International Announcement: WO2012/098870 WO 20120726
- Main IPC: B60R16/02
- IPC: B60R16/02 ; B60L3/00
Abstract:
A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.
Public/Granted literature
- US20130299235A1 Electrical Conduction Path Structure and Wiring harness Incorporating the Same Public/Granted day:2013-11-14
Information query
