A driver unit has a rotating electric machine and a frame member that is disposed on one axial end of the rotating electric machine. A substrate is fixed onto one surface of the frame member which faces away from the rotating electric machine. Switching elements constituting inverters for switching power supply to winding groups are mounted on a first surface for enabling heat dissipation toward the frame member. An Integrated Circuit (IC) is mounted on the first surface for enabling heat dissipation toward the frame member. An electronic component is mounted on a second surface at an overlapping position that at least partially overlaps a mounting position of the IC.