Invention Grant
- Patent Title: MEMS devices, packaged MEMS devices, and methods of manufacture thereof
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Application No.: US14606951Application Date: 2015-01-27
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Publication No.: US09359194B2Publication Date: 2016-06-07
- Inventor: Kai-Chih Liang , Chun-Wen Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81C1/00 ; B81B7/02 ; B81B7/00
Abstract:
MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure.
Public/Granted literature
- US20150137283A1 MEMS Devices, Packaged MEMS Devices, and Methods of Manufacture Thereof Public/Granted day:2015-05-21
Information query
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