Invention Grant
- Patent Title: Carrier-substrate adhesive system
- Patent Title (中): 载体基材粘合剂体系
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Application No.: US14459879Application Date: 2014-08-14
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Publication No.: US09359198B2Publication Date: 2016-06-07
- Inventor: Corey Patrick Fucetola , Henry Ignatius Smith , Jay J. Fucetola
- Applicant: Massachusetts Institute of Technology
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agency: Nields, Lemack & Frame, LLC
- Main IPC: B29C65/52
- IPC: B29C65/52 ; B32B37/06 ; B32B38/10 ; B82Y10/00 ; H01L21/683

Abstract:
A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublime or vaporize, thereby releasing the processed membrane from the carrier.
Public/Granted literature
- US20150053337A1 Carrier-Substrate Adhesive System Public/Granted day:2015-02-26
Information query