Invention Grant
US09359382B2 β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the same
有权
酮骨架配体，其制备方法，包含其的金属络合物和使用其制备薄膜的方法
- Patent Title: β-ketoimine ligand, method of preparing the same, metal complex comprising the same and method of forming thin film using the same
- Patent Title (中): 酮骨架配体，其制备方法，包含其的金属络合物和使用其制备薄膜的方法
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Application No.: US14317102Application Date: 2014-06-27
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Publication No.: US09359382B2Publication Date: 2016-06-07
- Inventor: Youn-Joung Cho , Senji Wada , Jung-Sik Choi , Jin-Seo Lee , Atsushi Sakurai , Kyoo-Chul Cho , Atsuya Yoshinaka , Haruyoshi Sato , Junji Ueyama , Tomoharu Yoshino , Masako Shimizu
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do JP Tokyo
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,ADEKA CORPORATION
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,ADEKA CORPORATION
- Current Assignee Address: KR Suwon-si, Gyeonggi-do JP Tokyo
- Agency: Lee & Morse, P.C.
- Priority: KR10-2011-0030224 20110401
- Main IPC: C23C16/06
- IPC: C23C16/06 ; C07F3/00 ; C07C249/02 ; C07C251/08 ; C23C16/18
Abstract:
The β-ketoimine ligand is represented by the following formula 1: wherein R1 and R2 are each independently a C1-C5 alkyl group. A metal complex compound includes the β-ketoimine ligand. A method of forming the β-ketoimine ligand and a method of forming a thin film using the metal complex compound including β-ketoimine ligand are provided.
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