Invention Grant
US09359476B2 Polyamide resin, preparation method therefor, and molded product including same
有权
聚酰胺树脂及其制备方法及包含其的成型体
- Patent Title: Polyamide resin, preparation method therefor, and molded product including same
- Patent Title (中): 聚酰胺树脂及其制备方法及包含其的成型体
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Application No.: US14655569Application Date: 2013-03-27
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Publication No.: US09359476B2Publication Date: 2016-06-07
- Inventor: So Young Kwon , Jin Kyu Kim , Seung Youb Bang , Eun Ju Lee , Sang Kyun Im , Ki Yon Lee , Suk Min Jun , Sung Chul Choi
- Applicant: Cheil Industries Inc.
- Applicant Address: KR Gumi-si
- Assignee: Cheil Industries Inc.
- Current Assignee: Cheil Industries Inc.
- Current Assignee Address: KR Gumi-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2012-0157673 20121228
- International Application: PCT/KR2013/002528 WO 20130327
- International Announcement: WO2014/104482 WO 20140703
- Main IPC: C08G69/26
- IPC: C08G69/26 ; C08G69/28 ; C08L77/00 ; C08G69/48 ; C08L77/06 ; C08G69/36
Abstract:
The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 μeq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.
Public/Granted literature
- US20150353681A1 Polyamide Resin, Preparation Method Therefor, and Molded Product Including Same Public/Granted day:2015-12-10
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