Invention Grant
US09359478B2 Curable compositions for LED encapsulants comprising a polycarbosilane and a hydrosilicone
有权
包含聚碳硅烷和氢硅氧烷的LED密封剂的可固化组合物
- Patent Title: Curable compositions for LED encapsulants comprising a polycarbosilane and a hydrosilicone
- Patent Title (中): 包含聚碳硅烷和氢硅氧烷的LED密封剂的可固化组合物
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Application No.: US14609984Application Date: 2015-01-30
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Publication No.: US09359478B2Publication Date: 2016-06-07
- Inventor: Thomas Xing , Liwei Zhang , Pasing Zhiming Li , Yong Zhang , Juan Du
- Applicant: Henkel AG & Co. KGaA
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Main IPC: C08G77/04
- IPC: C08G77/04 ; C08K5/5425 ; C08L83/16 ; C08G77/60 ; C08G77/12 ; C08G77/20
Abstract:
The present invention provides a curable composition, comprising: (A) at least one polycarbosilane A represented by the following formula (1): [R1R2R3SiX1/2]M[R4R5SiX2/2]D[R6SiX3/2]T[SiX4/2]Q (1), (B) at least one organopolysiloxane B represented by the following formula (2): [R7R8R9SiO1/2]M′[R10R11SiO2/2]D′[R12SiO3/2]T′[SiO4/2]Q′, (2), and (C) at least a catalyst, as well as a cured product obtainable by heating such composition, and the use of the composition as semiconductor encapsulating material and/or electronic elements packaging material.
Public/Granted literature
- US20150148510A1 CURABLE COMPOSITIONS FOR LED ENCAPSULANTS COMPRISING A POLYCARBOSILANE AND A HYDROSILICONE Public/Granted day:2015-05-28
Information query
