Invention Grant
- Patent Title: Hot-melt adhesives with improved adhesion on low-energy surfaces
- Patent Title (中): 具有改善低能量表面附着力的热熔胶
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Application No.: US13405944Application Date: 2012-02-27
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Publication No.: US09359534B2Publication Date: 2016-06-07
- Inventor: Dirk Urbach , Kai Paschkowski , Martin Linnenbrink
- Applicant: Dirk Urbach , Kai Paschkowski , Martin Linnenbrink
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: EP09168705 20090826
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B37/12 ; C09J123/02 ; C09J123/12 ; C08L23/08 ; C08L23/22 ; C08L51/00
Abstract:
A hot-melt adhesive composition, the use thereof, and a composite body including the hot-melt adhesive composition. The hot-melt adhesive composition includes a polyolefin P, which is solid at 25° C., a soft resin WH with a softening point between −10° C. and 40° C., and a polar modified polyolefin wax PW.
Public/Granted literature
- US20120171466A1 HOT-MELT ADHESIVES WITH IMPROVED ADHESION ON LOW-ENERGY SURFACES Public/Granted day:2012-07-05
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