Invention Grant
US09360241B2 Heat pump system 有权
热泵系统

Heat pump system
Abstract:
A heat pump system includes a heat pump circuit, a load distribution element, and a controller. The heat pump circuit includes low-stage and high-stage compression mechanisms having a fixed capacity ratio relationship. The load distribution element establishes a load distribution between first and second heat loads subjected to heating processes by heat exchange with refrigerant discharged from the low-stage and high-stage compression mechanisms, respectively. The controller performs distribution control to maintain a ratio of 1 between temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively. Alternatively, the controller performs distribution control to reduce a difference between the temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively.
Public/Granted literature
Information query
Patent Agency Ranking
0/0