Invention Grant
- Patent Title: Heat pump system
- Patent Title (中): 热泵系统
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Application No.: US13807710Application Date: 2011-07-13
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Publication No.: US09360241B2Publication Date: 2016-06-07
- Inventor: Hiroshi Nakayama , Shuji Fujimoto
- Applicant: Hiroshi Nakayama , Shuji Fujimoto
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Global IP Counselors
- Priority: JP2010-160745 20100715
- International Application: PCT/JP2011/065936 WO 20110713
- International Announcement: WO2012/008479 WO 20120119
- Main IPC: F25B30/02
- IPC: F25B30/02 ; F25B1/10 ; F24D17/02 ; F24D3/18 ; F25B40/00 ; F24D19/10

Abstract:
A heat pump system includes a heat pump circuit, a load distribution element, and a controller. The heat pump circuit includes low-stage and high-stage compression mechanisms having a fixed capacity ratio relationship. The load distribution element establishes a load distribution between first and second heat loads subjected to heating processes by heat exchange with refrigerant discharged from the low-stage and high-stage compression mechanisms, respectively. The controller performs distribution control to maintain a ratio of 1 between temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively. Alternatively, the controller performs distribution control to reduce a difference between the temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively.
Public/Granted literature
- US20130098102A1 HEAT PUMP SYSTEM Public/Granted day:2013-04-25
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