Invention Grant
- Patent Title: Pressure sensor chip
- Patent Title (中): 压力传感器芯片
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Application No.: US14053041Application Date: 2013-10-14
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Publication No.: US09360387B2Publication Date: 2016-06-07
- Inventor: Tomohisa Tokuda , Yuuki Seto
- Applicant: Azbil Corporation
- Applicant Address: JP Tokyo
- Assignee: AZBIL CORPORATION
- Current Assignee: AZBIL CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Troutman Sanders LLP
- Priority: JP2012-227640 20121015
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L13/02 ; G01L9/06

Abstract:
A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.
Public/Granted literature
- US20140102208A1 PRESSURE SENSOR CHIP Public/Granted day:2014-04-17
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