Invention Grant
US09360499B2 Socket for testing a semiconductor device and test equipment including the same
有权
用于测试半导体器件的插座和包括其的测试设备
- Patent Title: Socket for testing a semiconductor device and test equipment including the same
- Patent Title (中): 用于测试半导体器件的插座和包括其的测试设备
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Application No.: US13871275Application Date: 2013-04-26
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Publication No.: US09360499B2Publication Date: 2016-06-07
- Inventor: Youngchul Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0076266 20120712
- Main IPC: G01R31/20
- IPC: G01R31/20 ; H01R12/00 ; G01R1/04 ; G01R31/28 ; G11C29/56
Abstract:
A test socket has a housing with an inlet configured to receive a substrate. A plurality of terminals are coupled to the housing, and a plurality of sliding pins are coupled to the terminals. The pins are configured to make contact with respective pads or terminals of the substrate to be tested. The pins have different lengths or positions to send and receive test signals.
Public/Granted literature
- US20140015559A1 SOCKET FOR TESTING A SEMICONDUCTOR DEVICE AND TEST EQUIPMENT INCLUDING THE SAME Public/Granted day:2014-01-16
Information query
