Invention Grant
- Patent Title: Alignment correction method for substrate to be exposed, and exposure apparatus
- Patent Title (中): 要曝光的基板的对准校正方法和曝光装置
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Application No.: US14168212Application Date: 2014-01-30
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Publication No.: US09360776B2Publication Date: 2016-06-07
- Inventor: Yoshiaki Nomura , Toshinari Arai
- Applicant: V TECHNOLOGY CO., LTD.
- Applicant Address: JP Yokohama-shi
- Assignee: V TECHNOLOGY CO., LTD.
- Current Assignee: V TECHNOLOGY CO., LTD.
- Current Assignee Address: JP Yokohama-shi
- Agency: McDermott, Will & Emery LLP
- Priority: JP2011-170292 20110803
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G03B27/32 ; G03B27/74 ; G03F9/00 ; H01L21/68 ; G03F7/20

Abstract:
An alignment correction method includes: the step of detecting coordinates of a first observation point 14 and a second observation point 15 set in advance on a substrate to be exposed 1 that is being scanned in a scanning direction A, in order to observe an alignment deviation of the substrate to be exposed 1; the step of computing a correction amount based on a deviation between the detected coordinates and a reference line set in advance according to the first observation point 14 and the second observation point 15; and the step of correcting alignment of a subsequent substrate to be exposed 1 based on the computed correction amount.
Public/Granted literature
- US20140146299A1 ALIGNMENT CORRECTION METHOD FOR SUBSTRATE TO BE EXPOSED, AND EXPOSURE APPARATUS Public/Granted day:2014-05-29
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