Data perturbation for wafer inspection or metrology setup using a model of a difference

Invention Grant

US09360863B2 Data perturbation for wafer inspection or metrology setup using a model of a difference 有权

Title translation: 使用差异模型进行晶圆检测或计量设置的数据扰动

Patent Title: Data perturbation for wafer inspection or metrology setup using a model of a difference
Patent Title (中): 使用差异模型进行晶圆检测或计量设置的数据扰动
Application No.: US13258441

Application Date: 2011-06-09
Publication No.: US09360863B2

Publication Date: 2016-06-07
Inventor: Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
Applicant: Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
Applicant Address: US CA Milpitas
Assignee: KLA-Tencor Corp.
Current Assignee: KLA-Tencor Corp.
Current Assignee Address: US CA Milpitas
Agent Ann Marie Mewherter
International Application: PCT/US2011/039876 WO 20110609
International Announcement: WO2012/005863 WO 20120112
Main IPC: G06F17/50
IPC: G06F17/50 ; G05B19/418

Abstract:

Various embodiments for determining parameters for wafer inspection and/or metrology are provided.

Abstract(Chinese):

提供了用于确定晶片检查和/或度量的参数的各种实施例。

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