Invention Grant
- Patent Title: Routing signals via hinge assemblies for mobile computing devices
- Patent Title (中): 通过移动计算设备的铰链组件路由信号
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Application No.: US14142602Application Date: 2013-12-27
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Publication No.: US09360889B2Publication Date: 2016-06-07
- Inventor: Andy S. Idsinga , Gregory A. Peek
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/18
Abstract:
Embodiments of the invention describe a hinge assembly to rotatably couple a first housing to a second housing, wherein an interconnect extends through the hinge assembly as an incorporated portion of the hinge assembly, the interconnect to communicatively couple a component located in the first housing to a component located in a second housing.
Public/Granted literature
- US20150185763A1 ROUTING SIGNALS VIA HINGE ASSEMBLIES FOR MOBILE COMPUTING DEVICES Public/Granted day:2015-07-02
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