Invention Grant
- Patent Title: Low-profile hinge for an electronic device
- Patent Title (中): 电子设备的低调铰链
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Application No.: US14229830Application Date: 2014-03-28
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Publication No.: US09360896B2Publication Date: 2016-06-07
- Inventor: Min Suet Lim , Bok Eng Cheah , Howe Yin Loo , Jackson Chung Peng Kong , Poh Tat Oh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: E05D3/06
- IPC: E05D3/06 ; G06F1/16

Abstract:
Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low-profile hinge design that includes a first segment that connects to a first element using a first coupler and to a second segment that connects to the first segment using a second coupler, where the second segment connects to a second element using a third coupler. The first coupler, the second coupler, and the third coupler may each have a first coupling arm and a second coupling arm and the first coupling arm can be offset from a plane of the second coupling arm by about five degrees to about forty-five degrees.
Public/Granted literature
- US20150277505A1 LOW-PROFILE HINGE FOR AN ELECTRONIC DEVICE Public/Granted day:2015-10-01
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