Invention Grant
US09362151B2 Substrate warp correcting device and substrate warp correcting method
有权
基板翘曲矫正装置和基板翘曲校正方法
- Patent Title: Substrate warp correcting device and substrate warp correcting method
- Patent Title (中): 基板翘曲矫正装置和基板翘曲校正方法
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Application No.: US14178664Application Date: 2014-02-12
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Publication No.: US09362151B2Publication Date: 2016-06-07
- Inventor: Touru Mannen , Akira Kamijo
- Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Applicant Address: JP Nagano-shi
- Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2013-036842 20130227; JP2013-264875 20131224
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/67 ; H01L21/687 ; H05K1/02 ; H05K3/00 ; H05K3/46
Abstract:
A substrate warp correcting device includes, a lower member including a concave portion, and the lower member on which a substrate is to be arranged, an upper member arranged above the lower member, and the upper member including a gas supplying hole, wherein the substrate is arranged between the lower member and the upper member and above the concave portion, and a sealing member arranged between a periphery part of the substrate and the upper member, and the sealing member sealing a space between the substrate and the upper member.
Public/Granted literature
- US20140242729A1 SUBSTRATE WARP CORRECTING DEVICE AND SUBSTRATE WARP CORRECTING METHOD Public/Granted day:2014-08-28
Information query
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