Invention Grant
- Patent Title: Method for treatment of a temporarily bonded product wafer
- Patent Title (中): 用于处理临时粘合的产品晶片的方法
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Application No.: US13575316Application Date: 2010-11-23
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Publication No.: US09362154B2Publication Date: 2016-06-07
- Inventor: Jürgen Burggraf , Harald Wiesbauer , Markus Wimplinger
- Applicant: Jürgen Burggraf , Harald Wiesbauer , Markus Wimplinger
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- Priority: DE102010007127 20100205
- International Application: PCT/EP2010/007098 WO 20101123
- International Announcement: WO2011/095189 WO 20110811
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/683
Abstract:
A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on one flat side facing away from the carrier wafer to a product wafer thickness D of
Public/Granted literature
- US20120292288A1 METHOD FOR TREATMENT OF A TEMPORARILY BONDED PRODUCT WAFER Public/Granted day:2012-11-22
Information query
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