Invention Grant
- Patent Title: Dielectric liner for a self-aligned contact via structure
- Patent Title (中): 用于自对准接触通孔结构的电介质衬垫
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Application No.: US14510606Application Date: 2014-10-09
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Publication No.: US09362170B2Publication Date: 2016-06-07
- Inventor: Veeraraghavan S. Basker , Kangguo Cheng , Ali Khakifirooz
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/06 ; H01L29/66 ; H01L21/768 ; H01L29/78

Abstract:
At least one dielectric material layer having a top surface above the topmost surface of the gate electrode of a field effect transistor is formed. Active region contact via structures are formed through the at least one dielectric material layer to the source region and the drain region. A self-aligned gate contact cavity is formed over the gate electrode such that at least one sidewall of the gate contact cavity is a sidewall of the active region contact via structures. A dielectric spacer is formed at the periphery of the gate contact cavity by deposition of a dielectric liner and an anisotropic etch. A conductive material is deposited in the gate contact cavity and planarized to form a self-aligned gate contact via structure that is electrically isolated from the active region contact via structures by the dielectric spacer.
Public/Granted literature
- US20150270359A1 DIELECTRIC LINER FOR A SELF-ALIGNED CONTACT VIA STRUCTURE Public/Granted day:2015-09-24
Information query
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