Invention Grant
- Patent Title: Circuit device
- Patent Title (中): 电路设备
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Application No.: US13878718Application Date: 2011-09-15
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Publication No.: US09362205B2Publication Date: 2016-06-07
- Inventor: Takashi Shibasaki , Hidefumi Saito , Takahisa Makino , Masanori Shimizu , Daisuke Sasaki
- Applicant: Takashi Shibasaki , Hidefumi Saito , Takahisa Makino , Masanori Shimizu , Daisuke Sasaki
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Robert F. Hightower
- Priority: JP2010-213697 20100924
- International Application: PCT/JP2011/005210 WO 20110915
- International Announcement: WO2012/039115 WO 20120329
- Main IPC: H01L23/482
- IPC: H01L23/482 ; H01L23/049 ; H01L23/373 ; H01L23/498 ; H01L25/07 ; H02M7/537 ; H01L31/02 ; H01L23/24 ; H01L23/00 ; H01L23/29 ; H01L23/31
Abstract:
A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.
Public/Granted literature
- US20130286617A1 CIRCUIT DEVICE Public/Granted day:2013-10-31
Information query
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