Invention Grant
- Patent Title: Bonding structure including metal nano particle
- Patent Title (中): 粘结结构包括金属纳米颗粒
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Application No.: US14247272Application Date: 2014-04-08
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Publication No.: US09362242B2Publication Date: 2016-06-07
- Inventor: Aya Iwata , Yasunari Hino
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2013-164777 20130808
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L29/16 ; H01L23/482 ; H01L23/367 ; H01L23/373
Abstract:
A bonding structure including metal nano particles includes a first member having a metal surface on at least one side, a second member having a metal surface on at least one side, the second member being disposed such that the metal surface of the second member faces the metal surface of the first member, and a bonding material bonding the first member and the second member by sinter-bonding the metal nano particles. At least one of the metal surfaces of the first member and the second member is formed to be a rough surface having a surface roughness within the range from 0.5 μm to 2.0 μm.
Public/Granted literature
- US20150041827A1 BONDING STRUCTURE INCLUDING METAL NANO PARTICLES AND BONDING METHOD USING METAL NANO PARTICLES Public/Granted day:2015-02-12
Information query
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