Invention Grant
- Patent Title: FinFET and method of fabrication
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Application No.: US14528266Application Date: 2014-10-30
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Publication No.: US09362309B2Publication Date: 2016-06-07
- Inventor: Thomas N. Adam , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L27/12 ; H01L21/8234 ; H01L27/088 ; H01L21/02 ; H01L29/78 ; H01L27/11

Abstract:
An improved finFET and method of fabrication is disclosed. Embodiments of the present invention take advantage of the different epitaxial growth rates of {110} and {100} silicon. Fins are formed that have {110} silicon on the fin tops and {100} silicon on the long fin sides (sidewalls). The lateral epitaxial growth rate is faster than the vertical epitaxial growth rate. The resulting merged fins have a reduced merged region in the vertical dimension, which reduces parasitic capacitance. Other fins are formed with {110} silicon on the fin tops and also {110} silicon on the long fin sides. These fins have a slower epitaxial growth rate than the {100} side fins, and remain unmerged in a semiconductor integrated circuit, such as an SRAM circuit.
Public/Granted literature
- US20150056792A1 FINFET AND METHOD OF FABRICATION Public/Granted day:2015-02-26
Information query
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