Invention Grant
- Patent Title: Method for producing multi-gate in FIN field-effect transistor
- Patent Title (中): 在FIN场效应晶体管中制造多栅极的方法
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Application No.: US14585615Application Date: 2014-12-30
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Publication No.: US09362387B2Publication Date: 2016-06-07
- Inventor: Jing Zhao
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose P.C.
- Agent Grant Rodolph; Nicholas K. Beaulieu
- Priority: CN201310046136 20130205
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/28

Abstract:
A method for producing a multi-gate fin field-effect transistor (FinFET) is provided. The method includes forming a channel layer and a gate medium layer on a substrate; forming an amorphous silicon layer on the substrate, and etching the amorphous silicon layer, to form at least one fin; forming, by using an epitaxial growth process, a first protective layer from both sides to the middle of the substrate along a length direction of the at least one fin until a groove is formed in a middle location along the length direction of the at least one fin; forming a gate electrode layer on the substrate, performing planarization processing on the gate electrode layer to expose the first protective layer, and etching away the first protective layer by using an etching process, so as to form a gate electrode; and forming a source electrode and a drain electrode on the substrate.
Public/Granted literature
- US20150228764A1 Method for Producing Multi-Gate in FIN Field-Effect Transistor Public/Granted day:2015-08-13
Information query
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