Invention Grant
US09362455B2 Semiconductor light emitting diodes having multiple bond pads and current spreading structures
有权
具有多个接合焊盘和电流扩展结构的半导体发光二极管
- Patent Title: Semiconductor light emitting diodes having multiple bond pads and current spreading structures
- Patent Title (中): 具有多个接合焊盘和电流扩展结构的半导体发光二极管
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Application No.: US13034267Application Date: 2011-02-24
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Publication No.: US09362455B2Publication Date: 2016-06-07
- Inventor: John Adam Edmond , Matthew Donofrlo , Shawn Pyles
- Applicant: John Adam Edmond , Matthew Donofrlo , Shawn Pyles
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel & Sibley, PA
- Main IPC: H01L33/36
- IPC: H01L33/36 ; H01L33/62 ; H01L33/38 ; H01L33/08 ; H01L33/40 ; H01L33/50 ; H01L33/58
Abstract:
A light emitting device includes a diode region comprising a first face and opposing edges, and a bond pad structure comprising at least three bond pads along only one of the opposing edges of the first face.
Public/Granted literature
- US20120217530A1 Semiconductor Light Emitting Diodes Having Multiple Bond Pads and Current Spreading Structures Public/Granted day:2012-08-30
Information query
IPC分类:
