Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US14345315Application Date: 2012-08-03
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Publication No.: US09362462B2Publication Date: 2016-06-07
- Inventor: Seung Ryong Park
- Applicant: Seung Ryong Park
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2011-0092868 20110915
- International Application: PCT/KR2012/006203 WO 20120803
- International Announcement: WO2013/039293 WO 20130321
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/64 ; H01L33/60 ; H01L33/48
Abstract:
Disclosed is a light emitting device package. The light emitting device package includes a body part provided therein with a cavity, a light emitting chip in the cavity, a cover part to cover the cavity, and a light conversion part provided on a bottom surface of the cover part while being separated from the light emitting chip.
Public/Granted literature
- US20140346547A1 Light Emitting Device Package Public/Granted day:2014-11-27
Information query
IPC分类:
