Invention Grant
- Patent Title: Package-in-package semiconductor sensor device
- Patent Title (中): 封装封装半导体传感器器件
-
Application No.: US14337225Application Date: 2014-07-22
-
Publication No.: US09362479B2Publication Date: 2016-06-07
- Inventor: Wai Yew Lo
- Applicant: Wai Yew Lo
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles E. Bergere
- Main IPC: G01P15/08
- IPC: G01P15/08 ; H01L41/113 ; H01L41/23 ; H01L41/25 ; H01L41/053 ; H01L41/04
Abstract:
A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.
Public/Granted literature
- US20160027992A1 PACKAGE-IN-PACKAGE SEMICONDUCTOR SENSOR DEVICE Public/Granted day:2016-01-28
Information query
IPC分类:
