Invention Grant
- Patent Title: Method of manufacturing a flexible electronic device and flexible device
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Application No.: US13118556Application Date: 2011-05-30
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Publication No.: US09362511B2Publication Date: 2016-06-07
- Inventor: Jacobus Bernardus Giesbers , Monique Johanna Beenhakkers , Cornelis Johannus Hermanus Antonius Rijpert , Gerwin Hermanus Gelinck , Fredericus Johannes Touwslager
- Applicant: Jacobus Bernardus Giesbers , Monique Johanna Beenhakkers , Cornelis Johannus Hermanus Antonius Rijpert , Gerwin Hermanus Gelinck , Fredericus Johannes Touwslager
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: EP03100879 20030402
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L23/538 ; H01L51/00 ; H01L21/762 ; H01L51/05 ; H01L27/12 ; H01L29/786

Abstract:
An electrical element, such as a thin-film transistor, is defined on a flexible substrate, in that the substrate is attached to a carrier by an adhesive layer, and is delaminated after definition of the transistor. This is for instance due to illumination by UV-radiation. An opaque coating is provided to protect any semiconductor material. A heat treatment is preferably given before application of the layers of the transistor to reduce stress in the adhesive layer.
Public/Granted literature
- US20110227084A1 METHOD OF MANUFACTURING A FLEXIBLE ELECTRONIC DEVICE AND FLEXIBLE DEVICE Public/Granted day:2011-09-22
Information query
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