Invention Grant
- Patent Title: Orthogonal backplane design with reduced chassis depth
- Patent Title (中): 正交底板设计，底盘深度减小
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Application No.: US14321683Application Date: 2014-07-01
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Publication No.: US09362641B2Publication Date: 2016-06-07
- Inventor: Alexander Bachmutsky
- Applicant: Telefonaktiebolaget L M Ericsson (publ)
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget L M Ericsson (publ)
- Current Assignee: Telefonaktiebolaget L M Ericsson (publ)
- Current Assignee Address: SE Stockholm
- Agency: Nicholson De Vos Webster & Elliott, LLP
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R12/73
Abstract:
According to some embodiments of the invention a device includes a first circuit board having a hollow slot, wherein a longitudinal length of the hollow slot is greater than a transverse length of the hollow slot, wherein a longitudinal axis of the hollow slot is parallel to a first edge of the first circuit board, wherein the hollow slot causes a gap at a second edge of the first circuit board, and wherein the hollow slot is adapted to accept a second circuit board that is oriented orthogonally to the first circuit board. The device may further include a first data transferring connector coupled to the first circuit board at a longitudinal terminus of the hollow slot, wherein the first data transferring connector is adapted to connect to a second data transferring connector that is coupled to the second circuit board.
Public/Granted literature
- US20160006150A1 ORTHOGONAL BACKPLANE DESIGN WITH REDUCED CHASSIS DEPTH Public/Granted day:2016-01-07
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