Invention Grant
- Patent Title: Mating interfaces for high speed high density electrical connector
- Patent Title (中): 用于高速高密度电连接器的接合接口
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Application No.: US14209795Application Date: 2014-03-13
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Publication No.: US09362646B2Publication Date: 2016-06-07
- Inventor: Thomas S. Cohen
- Applicant: Thomas S. Cohen
- Applicant Address: US CT Wallingford Center
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford Center
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01R13/05
- IPC: H01R13/05 ; H01R13/02 ; H01R43/26 ; H01R13/11 ; H01R43/16 ; H01R12/73

Abstract:
Mating interfaces for high speed, high density electrical connectors. In some embodiments, a contact comprises a base region, a first elongated member comprising a distal end attached to the base region and a proximal portion, a second elongated member comprising a distal end attached to the base region and a proximal portion, and a strap coupling the distal portion of the first elongated member to the distal portion of the second elongated member, wherein the strap is conductive and compliant such that the distal portion of the first elongated member is capable of moving independently of and is electrically connected to the distal portion of the second elongated member.
Public/Granted literature
- US20150118922A9 MATING INTERFACES FOR HIGH SPEED HIGH DENSITY ELECTRICAL CONNECTOR Public/Granted day:2015-04-30
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