Invention Grant
- Patent Title: Rate scalable connector for high bandwidth consumer applications
- Patent Title (中): 用于高带宽消费应用的速率可伸缩连接器
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Application No.: US13997096Application Date: 2011-12-14
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Publication No.: US09362684B2Publication Date: 2016-06-07
- Inventor: James E. Jaussi , Stephen R. Mooney , Howard L. Heck , Bruce E. Pederson , Bryan K. Casper
- Applicant: James E. Jaussi , Stephen R. Mooney , Howard L. Heck , Bruce E. Pederson , Bryan K. Casper
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jordan IP Law, LLC
- International Application: PCT/US2011/064927 WO 20111214
- International Announcement: WO2013/089704 WO 20130620
- Main IPC: H01R13/66
- IPC: H01R13/66 ; H01R12/72 ; H01R24/62

Abstract:
Methods and systems may include an input/output (IO) interface that has an integrated buffer, a housing and a substrate disposed within the housing. The substrate may include a first side, a second side and a connection edge. The integrated buffer can be coupled to at least one of the first side and the second side of the substrate. A plurality of rows of contacts may be coupled to the first side of the substrate. Each row of contacts can be stacked substantially parallel to the connection edge. The substrate may have power outputs coupled thereto and the integrated buffer can include a voltage regulator that has a supply output coupled to the power outputs.
Public/Granted literature
- US20140357128A1 RATE SCALABLE CONNECTOR FOR HIGH BANDWIDTH CONSUMER APPLICATIONS Public/Granted day:2014-12-04
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