Invention Grant
- Patent Title: Printed circuit board and method for manufacturing same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US13997420Application Date: 2011-12-23
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Publication No.: US09363883B2Publication Date: 2016-06-07
- Inventor: Sung Wuk Ryu , Seong Bo Shim , Seung Yul Shin
- Applicant: Sung Wuk Ryu , Seong Bo Shim , Seung Yul Shin
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2010-0134543 20101224; KR10-2011-0052487 20110531
- International Application: PCT/KR2011/010058 WO 20111223
- International Announcement: WO2012/087073 WO 20120628
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K1/02 ; H05K3/40 ; H05K3/34
Abstract:
A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad and having an narrow width than the opening of the solder resist.
Public/Granted literature
- US20140000951A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME Public/Granted day:2014-01-02
Information query
