Invention Grant
- Patent Title: Circuit assembly and corresponding methods
- Patent Title (中): 电路组装及相应的方法
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Application No.: US13946351Application Date: 2013-07-19
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Publication No.: US09363892B2Publication Date: 2016-06-07
- Inventor: Paul R Steuer , Mark A Barabolak , Patrick J Cauwels , Timothy J Sutherland
- Applicant: Google Technology Holdings LLC
- Applicant Address: US CA Mountain View
- Assignee: Google Technology Holdings LLC
- Current Assignee: Google Technology Holdings LLC
- Current Assignee Address: US CA Mountain View
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11 ; H05K1/02 ; H05K5/00 ; H05K3/36 ; H05K9/00 ; H05K3/34

Abstract:
A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members (1301,1302,1303,1304) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate.
Public/Granted literature
- US20150022986A1 Circuit Assembly and Corresponding Methods Public/Granted day:2015-01-22
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