Invention Grant
- Patent Title: Housing assembly for a portable electronic device
- Patent Title (中): 便携式电子设备的外壳组件
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Application No.: US13825046Application Date: 2011-01-21
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Publication No.: US09363912B2Publication Date: 2016-06-07
- Inventor: Mark David Senatori
- Applicant: Mark David Senatori
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc Patent Department
- International Application: PCT/US2011/022160 WO 20110121
- International Announcement: WO2012/099608 WO 20120726
- Main IPC: B32B3/24
- IPC: B32B3/24 ; H05K5/03 ; G06F1/16 ; B29C65/54
Abstract:
Embodiments of the present invention disclose a housing assembly for a portable electronic device. According to one embodiment, the housing assembly includes a first panel cover positioned adjacent to a support frame having an integrated pattern of channel cavities. Furthermore, a second panel cover is positioned adjacent to the support frame on an opposite side thereof with respect to the first panel cover.
Public/Granted literature
- US20130175911A1 HOUSING ASSEMBLY FOR A PORTABLE ELECTRONIC DEVICE Public/Granted day:2013-07-11
Information query
