Invention Grant
- Patent Title: Adaptable slice electronics packaging
- Patent Title (中): 适应片式电子封装
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Application No.: US13712204Application Date: 2012-12-12
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Publication No.: US09363915B1Publication Date: 2016-06-07
- Inventor: Richard E. Berkenbush , Edward D. O'Neill , Christopher Errick
- Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Sand & Sebolt, LPA
- Agent Daniel J. Long
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H05K13/00 ; H05K7/02 ; H05K7/20
Abstract:
A system and method for building an electronic system with line-replaceable units (LRUs) is presented. The system includes a first LRU electronic module with a first connector on a side of the first LRU electronic module and a second LRU electronic module with a second connector on a side of the second LRU electronic module. To build the electronic system, the first connector on the first LRU electronic module is connected to the connector on the second LRU electronic module to form a first LRU electronic module and a second LRU electronic module combination with the first connector and the second connector interior to the module combination formed by the first LRU electronic module and the second LRU electronic module. The first connector and the second connector cannot be seen from outside the module combination formed by the first LRU electronic module and the second LRU electronic module.
Information query
