A module-type data center includes: a casing including a first intake opening, a second intake opening, and an exhaust opening; an air conditioner provided in the casing and configured to generate a first airflow by taking in outside air through the first intake opening and bringing the outside air into direct contact with a refrigerant; a fan unit provided in the casing and configured to generate a second airflow by taking in the outside air through the second intake opening; and an electronic device provided in the casing and configured to be air-cooled by a mixed airflow of the first airflow and the second airflow and release an exhaust airflow after the air-cooling to the exhaust opening. The first intake opening and the second intake opening are provided on different surfaces of the casing.