Invention Grant
- Patent Title: Reactive hot melt adhesive
- Patent Title (中): 活性热熔胶
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Application No.: US13839138Application Date: 2013-03-15
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Publication No.: US09365751B2Publication Date: 2016-06-14
- Inventor: Wu Suen
- Applicant: Henkel Corporation
- Applicant Address: DE Duesseldorf
- Assignee: Henkel IP & Holding GmbH
- Current Assignee: Henkel IP & Holding GmbH
- Current Assignee Address: DE Duesseldorf
- Agent James E. Piotrowski
- Main IPC: C09J11/06
- IPC: C09J11/06 ; C09J5/06 ; C08G18/28 ; C09J175/04 ; C09J201/10 ; C08K5/01 ; C08K5/5425 ; C08L91/06 ; C08L93/04
Abstract:
The present invention relates to silane reactive hot melt adhesive compositions having improved green strength, the production of such adhesives and the use of such adhesives.
Public/Granted literature
- US20140027056A1 REACTIVE HOT MELT ADHESIVE Public/Granted day:2014-01-30
Information query
IPC分类:
