Invention Grant
US09368198B1 Circuits and methods for placing programmable impedance memory elements in high impedance states 有权
将可编程阻抗存储器元件置于高阻态中的电路和方法

Circuits and methods for placing programmable impedance memory elements in high impedance states
Abstract:
A memory device can include a plurality of two terminal conductive bridging random access memory (CBRAM) type memory elements; at least one program transistor configured to enable a program current to flow through at least one memory element in response to the application of a program signal at its control terminal and a program bias voltage to the memory element; and an erase load circuit that includes at least one two-terminal diode-like load element, the erase load circuit configured to enable an erase current to flow through the load element and at least one memory element in a direction opposite to that of the program current.
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