Invention Grant
- Patent Title: Multilayer ceramic capacitor with conductive fullerene-filling resin layer, method for same, and mounting board with same
- Patent Title (中): 具有导电富勒烯填充树脂层的多层陶瓷电容器，其方法及其安装板
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Application No.: US14196911Application Date: 2014-03-04
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Publication No.: US09368251B2Publication Date: 2016-06-14
- Inventor: Kyung Pyo Hong , Doo Young Kim , Chang Hoon Kim , Sang Hyun Park , Hae Sock Chung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0154480 20131212
- Main IPC: H01B1/24
- IPC: H01B1/24 ; H01B1/02 ; H01G2/06 ; H01G4/12 ; H01G4/30 ; H01G4/232
Abstract:
A multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layer and containing conductive particles, fullerenes, and a base resin.
Public/Granted literature
- US20150170786A1 MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF AND MOUNTING BOARD THEREFOR Public/Granted day:2015-06-18
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