Invention Grant
- Patent Title: Multi-layered capacitor and circuit board mounted with multi-layered capacitor
- Patent Title (中): 多层电容器和电路板搭载多层电容器
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Application No.: US14075544Application Date: 2013-11-08
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Publication No.: US09368280B2Publication Date: 2016-06-14
- Inventor: Min Cheol Park , Young Ghyu Ahn , Sang Soo Park , Joon Yeob Cho
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0004439 20130115
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H05K3/34 ; H01G4/30 ; H01G4/38

Abstract:
Disclosed herein is a multi-layered capacitor, including: an element formed by alternately multi-layering a dielectric layer and an internal electrode; and external terminals disposed at both ends of the element, wherein the dielectric layer disposed at an upper end U and a lower end L of the element is formed of a paraelectric material and the dielectric layer disposed at a central part C of the element is formed of a ferroelectric material.
Public/Granted literature
- US20140196937A1 MULTI-LAYERED CAPACITOR AND CIRCUIT BOARD MOUNTED WITH MULTI-LAYERED CAPACITOR Public/Granted day:2014-07-17
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