Invention Grant
- Patent Title: Cut last self-aligned litho-etch patterning
- Patent Title (中): 切割最后的自对准光刻蚀图案
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Application No.: US14154454Application Date: 2014-01-14
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Publication No.: US09368349B2Publication Date: 2016-06-14
- Inventor: Kuan-Wei Huang , Chia-Ying Lee , Ming-Chung Liang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/033
- IPC: H01L21/033 ; H01L27/11

Abstract:
The present disclosure relates to a method of performing a self-aligned litho-etch (SALE) process. In some embodiments, the method is performed by forming a spacer material over a substrate having a multi-layer hard mask with a first layer and an underlying second layer to provide a first cut layer, and forming a reverse material over the spacer material to form a second cut layer. A second plurality of openings, cut according to the second cut layer, are formed to expose the second layer at a positions corresponding to a second plurality of shapes of a SALE design layer. A first plurality of openings, cut according to the first cut layer, are formed to expose the second layer at a positions corresponding to a first plurality of shapes of the SALE design layer. The second layer is etched according to the first and second plurality of openings.
Public/Granted literature
- US20150200096A1 CUT LAST SELF-ALIGNED LITHO-ETCH PATTERNING Public/Granted day:2015-07-16
Information query
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