Invention Grant
- Patent Title: Mechanical debonding method and system
- Patent Title (中): 机械剥离方法和系统
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Application No.: US14253589Application Date: 2014-04-15
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Publication No.: US09368376B2Publication Date: 2016-06-14
- Inventor: Daquan Yu , Feng Jiang
- Applicant: National Center for Advanced Packaging Co., Ltd.
- Applicant Address: CN Wuxi, Jiangsu province
- Assignee: National Center for Advanced Packaging Co., Ltd.
- Current Assignee: National Center for Advanced Packaging Co., Ltd.
- Current Assignee Address: CN Wuxi, Jiangsu province
- Agency: SAC Attorneys LLP
- Agent James Cai
- Priority: CN201310211882 20130529
- Main IPC: H01L21/463
- IPC: H01L21/463 ; H01L21/68 ; H01L21/67 ; H01L21/683
Abstract:
A mechanical debonding method and system are provided. A mechanical debonding method, used to debond temporary bonding wafers formed by bonding a device wafer and a carrier wafer by an adhesive, includes: obtaining the height position of the adhesive through a thickness measurement apparatus; moving a cutting apparatus to a position between the device wafer and the carrier wafer based on the height position of the adhesive, then removing the adhesive at the edge of the temporary bonding wafers by the cutting apparatus; removing the carrier wafer from the temporary bonding wafers; cleaning the adhesive left on the surface of the device wafer.
Public/Granted literature
- US20140356988A1 Mechanical Debonding Method and System Public/Granted day:2014-12-04
Information query
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