Invention Grant
- Patent Title: Substrate conveying method, recording medium in which program is recorded for causing substrate conveying method to be executed, and substrate conveyor
- Patent Title (中): 基板输送方法，其中记录用于使基板输送方法执行的程序的记录介质和基板输送机
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Application No.: US13410368Application Date: 2012-03-02
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Publication No.: US09368384B2Publication Date: 2016-06-14
- Inventor: Daisuke Yamagishi , Katsuhiko Oyama , Masataka Sato , Yasushi Takeuchi
- Applicant: Daisuke Yamagishi , Katsuhiko Oyama , Masataka Sato , Yasushi Takeuchi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2011-050747 20110308
- Main IPC: B65H1/00
- IPC: B65H1/00 ; H01L21/677 ; H01L21/67 ; H01L21/673 ; H01L21/687 ; C23C16/458
Abstract:
A substrate conveying method conveying a layered body having first and second substrates stacked with a spacer member provided between their respective bottom surfaces facing each other includes receiving the first substrate by holding the first substrate from below its bottom surface using a first holding mechanism provided on a side of a first fork provided above a second fork, and turning the first fork upside down and placing the received first substrate on the second fork; receiving the spacer member held in a substrate holding part by holding the spacer member from above using a second holding mechanism provided on the same side of the first fork as the first holding mechanism, and placing the received spacer member on the first substrate; and holding the second substrate from above its top surface using the first holding mechanism, and placing the received second substrate on the spacer member.
Public/Granted literature
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