Invention Grant
- Patent Title: Method of forming shallow trench isolation structure
- Patent Title (中): 形成浅沟槽隔离结构的方法
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Application No.: US14858094Application Date: 2015-09-18
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Publication No.: US09368387B2Publication Date: 2016-06-14
- Inventor: Tai-Yung Yu , Hui Mei Jao , Jin-Lin Liang , Chien-Hua Li , Cheng-Long Tao , Shian Wei Mao , Chien-Chang Fang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/66 ; H01L21/02 ; H01L21/304 ; H01L21/306

Abstract:
A method of forming a shallow trench isolation (STI) structure in a substrate includes forming a pad oxide layer over the substrate. The method includes forming a nitride-containing layer over the pad oxide layer, wherein the nitride-containing layer has a first thickness. The method further includes forming the STI structure extending through the nitride-containing layer, into the substrate. The STI structure has a height above a top surface of the pad oxide layer. The method includes establishing a correlation between the first thickness, the height of the STI structure above the top surface of the pad oxide layer, and an offset between the first thickness and the height of the STI structure above the top surface of the pad oxide layer. The method includes calculating the height of the STI structure above the pad oxide layer based on the correlation, and selectively removing a determined thickness of the STI structure.
Public/Granted literature
- US20160005669A1 METHOD OF FORMING SHALLOW TRENCH ISOLATION STRUCTURE Public/Granted day:2016-01-07
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