Invention Grant
US09368408B2 Method of manufacturing a semiconductor device with buried channel/body zone and semiconductor device 有权
制造具有埋入通道/体区和半导体器件的半导体器件的方法

Method of manufacturing a semiconductor device with buried channel/body zone and semiconductor device
Abstract:
A semiconductor device includes a source zone of a first conductivity type formed in a first electrode fin that extends from a first surface into a semiconductor portion. A drain region of the first conductivity type is formed in a second electrode fin that extends from the first surface into the semiconductor portion. A channel/body zone is formed in a transistor fin that extends between the first and second electrode fins at a distance to the first surface. The first and second electrode fins extend along a first lateral direction. A width of first gate sections, which are arranged on opposing sides of the transistor fin, along a second lateral direction perpendicular to the first lateral direction is greater than a distance between the first and second electrode fins.
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