Invention Grant
US09368408B2 Method of manufacturing a semiconductor device with buried channel/body zone and semiconductor device
有权
制造具有埋入通道/体区和半导体器件的半导体器件的方法
- Patent Title: Method of manufacturing a semiconductor device with buried channel/body zone and semiconductor device
- Patent Title (中): 制造具有埋入通道/体区和半导体器件的半导体器件的方法
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Application No.: US14141839Application Date: 2013-12-27
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Publication No.: US09368408B2Publication Date: 2016-06-14
- Inventor: Stefan Tegen , Marko Lemke , Rolf Weis
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234 ; H01L21/8236 ; H01L27/088

Abstract:
A semiconductor device includes a source zone of a first conductivity type formed in a first electrode fin that extends from a first surface into a semiconductor portion. A drain region of the first conductivity type is formed in a second electrode fin that extends from the first surface into the semiconductor portion. A channel/body zone is formed in a transistor fin that extends between the first and second electrode fins at a distance to the first surface. The first and second electrode fins extend along a first lateral direction. A width of first gate sections, which are arranged on opposing sides of the transistor fin, along a second lateral direction perpendicular to the first lateral direction is greater than a distance between the first and second electrode fins.
Public/Granted literature
- US20150187654A1 Method of Manufacturing a Semiconductor Device with Buried Channel/Body Zone and Semiconductor Device Public/Granted day:2015-07-02
Information query
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