Invention Grant
- Patent Title: Integrated circuit film and method of manufacturing the same
- Patent Title (中): 集成电路膜及其制造方法
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Application No.: US13961927Application Date: 2013-08-08
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Publication No.: US09368427B2Publication Date: 2016-06-14
- Inventor: Chin-Sheng Lin , Cheng-Chia Kuo , Chih-Cheng Lin
- Applicant: Mxtran Inc.
- Applicant Address: TW Hsin Chu
- Assignee: MXTRAN INC.
- Current Assignee: MXTRAN INC.
- Current Assignee Address: TW Hsin Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: G06K21/06
- IPC: G06K21/06 ; H01L23/48 ; G06K7/10 ; G06K19/07 ; H01L23/31 ; H01L23/498 ; H01L21/56 ; H01L23/00
Abstract:
An integrated circuit film and a method of manufacturing the same are disclosed. The integrated circuit film includes a circuit board containing a circuit route; a first set of pads located on a first surface of the circuit board and configured to be applicable to ISO 7816 standard; and a semiconductor device mounted on the circuit board for communicating with at least one of the first set of pads. The first set of pads are arranged in two rows and the semiconductor device is mounted on the circuit board in a space between the two rows of pads.
Public/Granted literature
- US20140217614A1 INTEGRATED CIRCUIT FILM AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-08-07
Information query
