A method of manufacturing an integrated circuit package substrate is disclosed. The method may include forming a hole through a substrate layer in the package substrate. The method also includes inserting a prefabricated coaxial wire segment into the hole. The prefabricated coaxial wire segment may include a signal conductor, a ground conductor that surrounds the signal conductor, and dielectric material interposed between the signal conductor and the ground conductor. Furthermore, an integrated circuit package is also disclosed.