Invention Grant
US09368458B2 Die-on-interposer assembly with dam structure and method of manufacturing the same
有权
具有大坝结构的插入式插入式组件及其制造方法
- Patent Title: Die-on-interposer assembly with dam structure and method of manufacturing the same
- Patent Title (中): 具有大坝结构的插入式插入式组件及其制造方法
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Application No.: US13938821Application Date: 2013-07-10
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Publication No.: US09368458B2Publication Date: 2016-06-14
- Inventor: Chih-Wei Wu , Szu Wei Lu , Jing-Cheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L23/498 ; H01L23/00 ; H01L23/16 ; H01L23/544 ; H01L23/10 ; H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L23/48 ; H01L23/14 ; H01L21/48 ; H01L21/768
Abstract:
A semiconductor package includes an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a second corner edge of the interposer chip. A die is bonded to the frontside of the interposer chip. At least one dam structure is formed on the corner area of the backside of the interposer chip. The dam structure includes an edge aligned to at least one the first corner edge and the second corner edge of the interposer chip.
Public/Granted literature
- US20150014844A1 Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same Public/Granted day:2015-01-15
Information query
IPC分类:
