Invention Grant
US09368472B2 Flip-chip assembly process for connecting two components to each other
有权
用于将两个组件彼此连接的倒装芯片组装过程
- Patent Title: Flip-chip assembly process for connecting two components to each other
- Patent Title (中): 用于将两个组件彼此连接的倒装芯片组装过程
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Application No.: US13955246Application Date: 2013-07-31
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Publication No.: US09368472B2Publication Date: 2016-06-14
- Inventor: Baptiste Goubault de Brugiere , Alexis Bedoin
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Norton Rose Fulbright US LLP
- Priority: FR1257406 20120731
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00
Abstract:
The invention relates to a flip-chip assembly process for connecting two microelectronic components (1, 2) to each other. According to the invention, it is possible either to proportion the spacers (24) so that they are smaller than the interconnect bumps (22) or to oversize the latter so that their deformation, after having been plastic during the insertion of connective inserts (12), returns to the elastic regime once assembly contact between components (1,2) has been reached. Thanks to the invention, it is possible to control with great precision the gap between the two components during their assembly, and this without adding any additional steps to their manufacturing or to the assembly process.
Public/Granted literature
- US20140038355A1 Flip-Chip Assembly Process for Connecting Two Components to Each Other Public/Granted day:2014-02-06
Information query
IPC分类:
