Invention Grant
US09368517B2 Semiconductor device including bonding portion with first and second sealing materials 有权
半导体器件包括具有第一和第二密封材料的接合部分

Semiconductor device including bonding portion with first and second sealing materials
Abstract:
A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.
Public/Granted literature
Information query
Patent Agency Ranking
0/0