Invention Grant
US09368517B2 Semiconductor device including bonding portion with first and second sealing materials
有权
半导体器件包括具有第一和第二密封材料的接合部分
- Patent Title: Semiconductor device including bonding portion with first and second sealing materials
- Patent Title (中): 半导体器件包括具有第一和第二密封材料的接合部分
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Application No.: US14255394Application Date: 2014-04-17
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Publication No.: US09368517B2Publication Date: 2016-06-14
- Inventor: Shunpei Yamazaki , Takeshi Fukunaga
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP11-356736 19991205
- Main IPC: H05B33/04
- IPC: H05B33/04 ; H05B33/02 ; H01L27/12 ; G01N33/497 ; H01L27/32 ; H01L51/52 ; H01L33/62 ; H01L31/153 ; H05K3/36 ; H05K1/02 ; H05K3/32

Abstract:
A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.
Public/Granted literature
- US20140225130A1 Light-Emitting Device Public/Granted day:2014-08-14
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