Invention Grant
US09368617B2 Superjunction device and semiconductor structure comprising the same
有权
超结型器件和包含该结型器件的半导体结构
- Patent Title: Superjunction device and semiconductor structure comprising the same
- Patent Title (中): 超结型器件和包含该结型器件的半导体结构
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Application No.: US14524193Application Date: 2014-10-27
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Publication No.: US09368617B2Publication Date: 2016-06-14
- Inventor: Franz Hirler , Anton Mauder
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Eschweiler & Associates, LLC
- Priority: CN201320675262U 20131030
- Main IPC: H01L29/732
- IPC: H01L29/732 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/10 ; H01L29/40 ; H01L29/423 ; H01L29/08

Abstract:
The present disclosure relates to a superjunction device and a semiconductor structure having the same. The superjunction device includes a body region of a second conduction type, a drain region of a first conduction type, a drift region located between said body region and said drain region. The drift region includes first regions of a first conduction type and second regions of a second conduction type arranged alternately along a direction being perpendicular to the direction from the body region to the drain region, and a plurality of trench gate structures, each of them comprising a trench extending into said drift region from an upper surface of said body region and a gate electrode in said trench surrounded by a first dielectric layer filling said trench, and a source region of a first conduction type embedded into said body region. There is no source region along at least 10% of the total interface length between the first dielectric layer and the body region.
Public/Granted literature
- US20150115355A1 SUPERJUNCTION DEVICE AND SEMICONDUCTOR STRUCTURE COMPRISING THE SAME Public/Granted day:2015-04-30
Information query
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